3GPP Release 18 was frozen in 2024. The path from specification freeze to commercial modules typically runs 18-30 months, with chipset development, operator certification, and module production cycling through that period. eRedCap hardware is expected to reach market from 2026.
Chipset Vendors
Qualcomm – The Snapdragon X35 supports Release 17 RedCap and is in production (used in Semtech AirLink RX400/EX400 routers, among others). A Release 18 eRedCap successor is in development. Qualcomm has been the leading chipset vendor for first-generation RedCap adoption.
MediaTek – Active in 5G IoT chipsets with RedCap silicon. eRedCap roadmap in development.
Sequans Communications – IoT specialist with established NB-IoT and LTE-M products. 5G NR IoT including eRedCap on roadmap.
Telit Cinterion – Significant module vendor with an eRedCap roadmap alongside their existing Cat-1bis and RedCap portfolio.
Module Vendors
Quectel, Fibocom, u-blox, Sierra Wireless (Semtech AirLink), Thales (Cinterion), and Nordic Semiconductor are among the module vendors with eRedCap on product roadmaps for 2026-2027 availability. First-generation eRedCap modules are expected in M.2 and LCC formats targeting industrial and automotive applications, with compact SIP and LGA packages following as volumes develop.
What to Ask Your Module Vendor
When evaluating eRedCap module vendors, the key questions are: whether their eRedCap product will be form-factor compatible with their current Cat-1bis equivalent (some vendors are engineering for drop-in mechanical compatibility); whether their eRedCap module includes SGP.32-compliant eUICC for remote SIM management; and what their certification timeline is for key operators in your target deployment markets.
For current RedCap (Release 17) hardware available now, see the Hardware section.